TGV Glass Substrates
TGV technology offers several advantages over traditional silicon substrates:
Smaller size: Because glass substrates are thinner and the holes can be smaller, higher integration can be achieved, enabling the manufacturing of smaller electronic devices.
Better performance: TGV technology can reduce resistance and inductance between circuits, thereby enhancing device performance.
Higher density: Higher density connections can be achieved on glass substrates, allowing for more flexible circuit designs and richer functionalities.
Improved heat dissipation: Glass substrates have better heat dissipation properties compared to silicon substrates, contributing to increased device stability and reliability.
Piezoelectric material
Material: Synthetic quartz
Capability: Parallel plate lens , plano-convex, biconvex with doubly rotated cut.
Dimensions: φ4.5～φ14mm, 1.8X3～30X30mm
Frequency: 5Mhz(O3)～120Mhzz(O5)
Applications: Aerospace engineering, cell sites, satellites, etc.
Blue Glass
Material: SCHOTT BG series, CDGM QB series, Japan NEG, etc.
Dimensions: 77X77mm
Thickness: 0.11/0.145/0.21/0.3mm
Frequency: 5Mhz(O3)～120Mhzz(O5)
Applications: Mobile phone cameras, security cameras, and automotive electronics.
Other Optical Glasses
Material: SCHOTT B270, D263T, JGS1, OHARA glass, CORNING glass, CAIHONG glass, optical colored glass, optical quartz crystal, etc.
Capability: Flat surface grinding, polygon grinding
Dimensions: φ8～φ400mm, 8X8mm～300X300mm
Thickness: 0.07～15.0mm
Frequency: 5Mhz(O3)～120Mhz(O5)
Applications: Camera lens, medical devices, and projectors.
6" Glass Wafer
Dimensions: φ150+/-0.1mm
Thickness: 0.07～5.0mm+/-0.005mm
Material: D263T, BF33, JGS1,and SK1300
TTV: <0.5um
Warp: <=20um
Bow: <=15um
Mark: SEMI
Edge: Polishing
Ra: <= 0.5nm
Surface: 20-10, in compliance with MIL-PRF-13830B
8" Galss Wafer
Dimensions: φ200+/-0.1mm
Thickness: 0.07～5.0mm+/-0.005mm
Material: D263T, BF33, JGS1,and SK1300
TTV: <0.8um
Warp: <=30um
Bow: <=20um
Mark: SEMI
Edge: Polishing
Ra: <= 0.5nm
Surface: 20-10, in compliance with MIL-PRF-13830B
12" Glass Wafer
Dimensions: φ300+/-0.1mm
Thickness: 0.07～5.0mm+/-0.005mm
Material: D263T, BF33, JGS1,and SK1300
TTV: <0.8um
Warp: <=30um
Bow: <=20um
Mark: SEMI
Edge: Polishing
Ra: <= 0.5nm
Surface: 20-10, in compliance with MIL-PRF-13830B
Inspectoin instruments
TTV measurement instrument :
Zygo inspection instrument, accuracy 0.1 micrometers.
Flatness measurement instrument:
Inspecting WARP and BOW, accuracy of 0.1 micrometers, inspection maximum size D300mm.
Surface roughness measurement instrument
Veeco surface roughness inspector, accuracy 0.01 micrometers.
Particle size measurement instrument
Accuracy 0.1 micrometers.